We all know that MCU is an intelligent semiconductor IC that consists of a processor unit, memory modules, communication interfaces and peripherals, which comes in a die form in a package.

But what is a co-packaged microcontroller? Differentiated itself from single-die package, co-packaged MCU is actually a combined encapsulation of multiple dies, or of a regular MCU die with additional component inside a single package, thus to extend the MCU chip functions.

1. Advantages of Co-packaged MCUs

The benefits by packaging more than one die in a single package are quite self-evident:

A.The MCUs will be capable of extra functions, bringing additional value in same package.

B.Allow smaller PCB design especially for compact-size product.

C.Set a barrier to competitors who intend to copy your product design

D.The combination is a 1+1>2 cost-saving solution, further improving your product competition.

2. Customization

Such co-packaged MCUs allows for customization,which means you can choose from a range of chips or components that you need you encapsulate with usual microcontroller wafer, accodingly to specific development scenario. Take YFM’s co-packaging MCUs as example, the company recently released a series of products that combines their current NY8A / PY32 with additional components such as, 24C02,4054 charging IC, LDO, operational amplifier LM358, RF65 transceiver, MOS and so on. Undoubtedly, there are more on the way.